Thin film transistor substrate and method for manufacturing the same

ABSTRACT

A thin film transistor substrate includes a substrate; a first thin film transistor on the substrate and including a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode; a second thin film transistor on the substrate and including a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode; an intermediate insulating layer on the first gate electrode and the second gate electrode and under the oxide semiconductor layer; and a dummy layer between the first source electrode and the intermediate insulating layer and between the first drain electrode and the intermediate insulating layer, wherein the dummy layer is formed of a same material as the oxide semiconductor layer.

This application is a Divisional of U.S. patent application Ser. No.15/133,419, filed Apr. 20, 2016, which claims the priority benefit ofKorean Patent Application No. 10-2015-0055226, filed on Apr. 20, 2015,both which are incorporated herein by reference for all purposes as iffully set forth herein.

BACKGROUND OF THE INVENTION Field of the Invention

The present disclosure relates to a thin film transistor substrate, andmore particularly, to a thin film transistor substrate having twodifferent types of thin film transistors on the same substrate and amethod for manufacturing the same.

Discussion of the Related Art

Nowadays, as the information society is developed, the requirements ofdisplays for representing information are increasing. Accordingly,various flat panel displays (or ‘FPD’) are developed for overcoming manydrawbacks of the cathode ray tube (or ‘CRT’) such as heavy weight andbulk volume. Flat panel display devices include a liquid crystal displaydevice (or ‘LCD’), a plasma display panel (or ‘PDP’), an organic lightemitting display device (or ‘OLED’) and a electrophoresis display device(or ‘ED’).

The display panel of a flat panel display may include a thin filmtransistor substrate having a thin film transistor allocated in eachpixel region arrayed in a matrix manner. For example, the liquid crystaldisplay device (or ‘LCD’) represents video data by controlling the lighttransitivity of the liquid crystal layer using electric fields. Theorganic light emitting diode display represents video data by generatingproperly controlled light at each pixel disposed in a matrix mannerusing an organic light emitting diode formed in each pixel.

As a self-emitting display device, the organic light emitting diodedisplay device has merits including very fast response speed, highbrightness, and large viewing angle. The organic light emitting diodedisplay (or OLED) using the organic light emitting diode having goodenergy efficiency can be categorized in the passive matrix type organiclight emitting diode display (or PMOLED) and the active matrix typeorganic light emitting diode display (or AMOLED).

As personal appliances have been more adopted, portable and/or wearabledevices have been actively developed. To apply the display device for aportable and/or wearable device, the device should have low powerconsumption. However, using already developed technologies, a limitationhas been getting a display with low power consumption.

SUMMARY OF THE INVENTION

Accordingly, the present invention is directed to a thin film transistorsubstrate and method for manufacturing the same that substantiallyobviate one or more of the problems due to limitations and disadvantagesof the related art.

An object of the present invention is to provide a thin film transistorsubstrate for a flat panel display having at least two transistorshaving different characteristics from each other on the same substrate.

Another object of the present invention is to provide a thin filmtransistor substrate for a flat panel display having two different typesof transistors manufactured with an efficient manufacturing process andreduced number of mask processes.

Additional features and advantages of the invention will be set forth inthe description which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention. Theobjectives and other advantages of the invention will be realized andattained by the structure particularly pointed out in the writtendescription and claims hereof as well as the appended drawings.

In order to overcome the above mentioned drawbacks, the purpose of thepresent disclosure is to suggest a thin film transistor substrate forflat panel display having at least two transistors of whichcharacteristics are different each other on the same substrate, and amethod for manufacturing the same. Another purpose of the presentdisclosure is to suggest a method for manufacturing a thin filmtransistor substrate for flat panel display having two different typetransistors by the optimized processes and the minimized number of themask processes, and a thin film transistor substrate by the same method.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described, a thin filmtransistor substrate comprises a substrate; a first thin film transistoron the substrate and including a polycrystalline semiconductor layer, afirst gate electrode on the polycrystalline semiconductor layer, a firstsource electrode, and a first drain electrode; a second thin filmtransistor on the substrate and including a second gate electrode, anoxide semiconductor layer on the second gate electrode, a second sourceelectrode, and a second drain electrode; an intermediate insulatinglayer on the first gate electrode and the second gate electrode andunder the oxide semiconductor layer; and a dummy layer between the firstsource electrode and the intermediate insulating layer and between thefirst drain electrode and the intermediate insulating layer, wherein thedummy layer is formed of a same material as the oxide semiconductorlayer.

In another aspect, a thin film transistor substrate comprises asubstrate; a first semiconductor layer on the substrate and including apolycrystalline semiconductor material; a gate insulating layer coveringthe first semiconductor layer; a first gate electrode on the gateinsulating layer and overlapping the first semiconductor layer; a secondgate electrode on the gate insulating layer; an intermediate insulatinglayer covering the first gate electrode and the second gate electrode; asecond semiconductor layer on the intermediate insulating layer, andincluding an oxide semiconductor material overlapping the second gateelectrode; a first source electrode and a first drain electrode on theintermediate insulating layer, and including dummy layers having theoxide semiconductor material thereunder; and a second source electrodeand a second drain electrode on the second semiconductor layer.

In another aspect, A method for manufacturing a thin film transistorsubstrate comprises forming a first semiconductor layer on a substrate;depositing a gate insulating layer covering the first semiconductorlayer; forming a first gate electrode and a second gate electrode on thegate insulating layer; depositing an intermediate insulating layercovering the first gate electrode and the second gate electrode;depositing a second semiconductor material on the intermediateinsulating layer; exposing a first portion and a second portion of thefirst semiconductor layer by forming first and second contact holesthrough the second semiconductor material, the intermediate insulatinglayer. and the gate insulating layer; depositing a source-drain metalmaterial on the second semiconductor material; and forming a firstsource electrode, a first drain electrode, a second source electrode, asecond drain electrode and a second semiconductor layer, by patterningthe source-drain metal material and the second semiconductor material atthe same time.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention. In the drawings:

FIG. 1 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttype thin film transistors are formed, according to a first embodimentof the present disclosure.

FIG. 2 is a flow chart illustrating a method for manufacturing the thinfilm transistor substrate for a flat panel display in which twodifferent type thin film transistors are formed, according to the firstembodiment of the present disclosure.

FIG. 3 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttypes of thin film transistors are formed, according to a secondembodiment of the present disclosure.

FIG. 4 is a flow chart illustrating a method for manufacturing the thinfilm transistor substrate for a flat panel display in which twodifferent types of thin film transistors are formed according to thesecond embodiment of the present disclosure.

FIGS. 5A to 5F are cross sectional views illustrating the steps formanufacturing the thin film transistor substrate for a flat paneldisplay in which two different types of thin film transistors are formedaccording to the second embodiment of the present disclosure.

FIG. 6 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttype thin film transistors are formed according to a third embodiment ofthe present disclosure.

FIG. 7 is a flow chart illustrating a method for manufacturing the thinfilm transistor substrate for a flat panel display in which twodifferent type thin film transistors are formed according to the thirdembodiment of the present disclosure.

FIG. 8 is a block diagram illustrating a structure of a displayaccording to a first application example of the present disclosure.

FIG. 9 is a plane view illustrating a thin film transistor substratehaving an oxide semiconductor layer included in a fringe field typeliquid crystal display according to a second application example of thepresent disclosure.

FIG. 10 is a cross-sectional view illustrating the structure of the thinfilm transistor substrate of FIG. 9 by cutting along line I-I′ accordingto the second application example of the present disclosure.

FIG. 11 is a plane view illustrating the structure of one pixel for theactive matrix type organic light emitting diode display having activeswitching elements, such as thin film transistors according to a thirdapplication embodiment of the present disclosure.

FIG. 12 is a cross sectional view illustrating the structure of theorganic light emitting diode display along cutting line II-II′ in FIG.11 according to the third application embodiment of the presentdisclosure.

FIG. 13 is an enlarged plane view illustrating a structure of an organiclight emitting diode display according to a fourth applicationembodiment of the present disclosure.

FIG. 14 is a cross sectional view illustrating a structure of theorganic light emitting diode display along cutting line of in FIG. 13according to the fourth application embodiment of the presentdisclosure.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Hereinafter, the meaning for the term of “on” includes “directly on” and“indirectly on” in all scopes of the specifications. Of course, themeaning for the term of “under” includes “directly under” and“indirectly under” in all scopes of the specifications.

Referring to attached figures, we will explain preferred embodiments ofthe present disclosure. Like reference numerals designate like elementsthroughout the detailed description. However, the present disclosure isnot restricted by these embodiments but can be applied to variouschanges or modifications without changing the technical spirit. In thefollowing embodiments, the names of the elements are selected for easeof explanation and may be different from actual names.

The thin film transistor substrate for a flat panel display according tothe present disclosure comprises a first thin film transistor disposedin a first area and a second thin film transistor disposed in a secondarea, on the same substrate. The substrate may include a display areaand a non-display area. In the display area, a plurality of pixel areais arrayed in a matrix manner. In one pixel area, the display elementsare disposed. In the non-display area surrounding the display area, thedriver elements for driving the display elements in the pixel area aredisposed.

Here, the first area may be the non-display area, and the second areamay be some portions or all portions of the display area. In this case,the first thin film transistor and the second thin film transistor aredisposed as they may be apart from each other. Otherwise, the first areaand the second area may be included in the display area. Especially, forthe case that a plurality of thin film transistor are disposed in onepixel area, the first thin film transistor and the second thin filmtransistor may be closely disposed.

As the polycrystalline semiconductor material has the characteristics ofhigh mobility (over 100 cm²/Vs) and of low energy consumption power, andit has high reliability, it is proper to apply to the driver IC, such asthe gate driver and/or the multiplexer (or ‘MUX’) for driving thedisplay elements. In addition, it can be applied to the driving thinfilm transistor disposed in the pixel area of the organic light emittingdiode display. As the oxide semiconductor material has low off-current,it is proper to apply to the channel layer of the switching thin filmtransistor in the pixel area, in which the ON time period is very shortbut the OFF time period is long. Further, as the off-current is low, theholding time of the pixel voltage may be long, so that it is preferableto apply the display with low frequency drive and/or low powerconsumption. By disposing these two different type thin filmtransistors, the present disclosure suggests a thin film transistorsubstrate having an optimized function and characteristic for theportable and/or wearable displays.

When the semiconductor layer is formed using the polycrystallinesemiconductor material, the doping process and high temperaturetreatment process are used. On the contrary, when the semiconductorlayer is formed using the oxide semiconductor material, it is performedunder a relatively lower temperature process. Therefore, thepolycrystalline semiconductor layer, formed under a more severe heatcondition, may be first formed, and after that, the oxide semiconductorlayer may be formed. To do so, in the present disclosure, the first thinfilm transistor having the polycrystalline semiconductor material mayhave a top gate structure, and the second thin film transistor havingthe oxide semiconductor material would have a bottom gate structure.

Further, in view of manufacturing process, when the polycrystallinesemiconductor material has a lot of vacancy, the characteristics may beseverely degraded. Therefore, a hydrogenation process may be performedin which the vacancies are filled with hydrogen particles. On the otherhand, for the oxide semiconductor material, the vacancies may act as thecarriers so it may be desired that the thermal treatment be performedwith a small amount of vacancies in the oxide semiconductor material.These processes, the hydrogenation process and the thermal treatment,can be performed by a post-thermal process under a 350˜380° C.temperature condition.

For the hydrogenation process, a nitride layer having a lot of hydrogenparticles may be provided over the polycrystalline semiconductormaterial. As the materials used for depositing the nitride layer has alarge amount of hydrogen, a lot of hydrogen particles may be includedinto the deposited nitride layer. By the thermal process, the hydrogenparticles can be diffused into the polycrystalline semiconductormaterial. As the result, the polycrystalline semiconductor layer can bestabilized. During the thermal process, it is preferable that too muchof the hydrogen particles should not be diffused into the oxidesemiconductor material. Therefore, an oxide layer should be disposedbetween the nitride layer and the oxide semiconductor material. As aresult, the oxide semiconductor layer can be stabilized but may beaffected too much by the hydrogen particles.

Hereinafter, for convenience, the first thin film transistor is for thedriver IC disposed in the non-display area and the second thin filmtransistor is for the display element disposed in the pixel area of thedisplay area. However, embodiments are not restricted to this case. Forexample, in an organic light emitting diode display, the first thin filmtransistor and the second thin film transistor may be disposed at onepixel area in the display area. Especially, the first thin filmtransistor having the polycrystalline semiconductor material may beapplied for the driving thin film transistor, and the second thin filmtransistor having the oxide semiconductor material may be applied forthe switching thin film transistor.

First Embodiment

FIG. 1 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttype thin film transistors are formed, according to a first embodimentof the present disclosure. Here, the cross sectional views more clearlyand conveniently show the main features of the present disclosure.

With reference to FIG. 1, the thin film transistor substrate for a flatpanel display according to the first embodiment comprises a first thinfilm transistor T1 and a second thin film transistor T2 which aredisposed on the same substrate SUB. The first and second thin filmtransistors T1 and T2 may be apart far from each other, or they may bedisposed within a relatively close distance. Otherwise these two thinfilm transistors are disposed as being overlapping each other.

On the whole surface of the substrate SUB, a buffer layer BUF isdeposited. In some cases, the buffer layer BUF may not be included. Or,the buffer layer BUF may be a plurality of layers. Here, forconvenience, a single layer arrangement will be explained. Further, alight shield layer may be included at some required areas between thesubstrate SUB and the buffer layer BUF. The light shield layer may befurther disposed to prevent the light from inducing into thesemiconductor layer of the thin film transistor disposed thereon.

On the buffer layer BUF, a first semiconductor layer A1 is disposed. Thefirst semiconductor layer A1 includes a channel area of the first thinfilm transistor T1. The channel area is defined as the overlapped areabetween the first gate electrode G1 and the first channel layer A1. Asthe first gate electrode G1 is overlapped with the middle portions ofthe first semiconductor layer A1, the middle portion of the firstsemiconductor layer A1 is the channel area. The two areas expanded toboth sides of the channel area where the impurities are doped aredefined as the source area SA and the drain area DA, respectively.

For the case that the first thin film transistor T1 is for driver IC,the semiconductor layer may have a characteristic for high speedperformance with a lower power consumption. For example, P-MOS type orN-MOS type thin film transistor may be used or C-MOS type may be appliedfor the first thin film transistor T1. The P-MOS, N-MOS and/or C-MOStype thin film transistor may have a polycrystalline semiconductormaterial, such as poly-crystalline silicon (p-Si). Further, the firstthin film transistor T1 preferably has a top gate structure.

On the whole surface of the substrate SUB having the first semiconductorlayer A1, a gate insulating layer GI is deposited. The gate insulatinglayer GI may be made of the silicon nitride (SiNx) material or thesilicon oxide (SiOx) material. The gate insulating layer GI may have athickness of 1,000 Å˜1,500 Å for ensuring the stability andcharacteristics of the elements. In the case that the gate insulatinglayer GI may be made of silicon nitride (SiNx), in the view point ofmanufacturing process, the gate insulating layer GI includes a lot ofhydrogen particles. As these hydrogen particles would be diffused outfrom the gate insulating layer GI, the gate insulating layer GI may bemade of the silicon oxide material.

The diffusion of the hydrogen particles may cause positive effects onthe first semiconductor layer A1 including polycrystalline semiconductormaterial. However, it may cause negative effects on the second thin filmtransistor T2 having different material from the first thin filmtransistor T1. Therefore, when at least two thin film transistors havingdifferent characteristics each other are formed on the same substrateSUB, the gate insulating layer GI may be made of silicon oxide (SiOx),which is less likely to affect the semiconductor material. In somecases, unlike in the first embodiment, the gate insulating layer GI maybe deposited as having the thickness of 2,000 Å˜4,000 Å. In those cases,when the gate insulating layer GI is made of the nitride silicon (SiNx),much more of the hydrogen particles may be diffused. Considering thesecases, the gate insulating layer GI may be an oxide layer, such assilicon oxide (SiOx).

On the gate insulating layer GI, a first gate electrode G1 and thesecond gate electrode G2 are disposed. The first gate electrode G1 isdisposed over the middle portion of the first semiconductor layer A1.The second gate electrode G2 is located where the second thin filmtransistor T2 is disposed. The first and the second gate electrodes G1and G2 are formed on the same layer, with the same material, and byusing the same mask process. Therefore, the manufacturing process can besimplified.

An intermediate insulating layer ILD is deposited covering the first andthe second gate electrodes G1 and G2. The intermediate insulating layerILD has a multiple layer structure, in which a nitride layer SINincluding a silicon nitride (SiNx) and an oxide layer SIO including asilicon oxide (SiOx) are alternatively stacked. Here, for convenience ofexplanation, the intermediate insulating layer ILD, as described,includes two layers in which the oxide layer SIO is stacked on thenitride layer SIN.

The nitride layer SIN is deposited for performing the hydrogenationprocess to the first semiconductor layer A1 having the polycrystallinesilicon by diffusing the hydrogen particles into the polycrystallinesilicon. On the contrary, the oxide layer SIO is for preventing thehydrogen particles of the nitride layer SIN from being diffused too muchinto the semiconductor material of the second thin film transistor T2.

For example, the hydrogen going out from the nitride layer SIN maydiffuse into the first semiconductor layer A1 under the gate insulatinglayer GI. Therefore, the nitride layer SIN may be deposited as close tothe gate insulating layer GI as possible. On the contrary, the hydrogengoing out from the nitride layer SIN would not diffuse too much into thesemiconductor material of the second thin film transistor T2 over thegate insulating layer GI. Therefore, on the nitride layer SIN, the oxidelayer SIO should be deposited. Considering the manufacturing process,the intermediate insulating layer ILD may have a thickness of 2,000Å˜6,000 Å. Therefore, each thickness of the nitride layer SIN and theoxide layer SIO may have a thickness of 1,000 Å˜3,000A, respectively.Further, in order that much more amount of the hydrogen particles fromthe nitride layer SIN into the first semiconductor layer A1, but thehydrogen particles may not affect the second semiconductor layer A2, itis preferable that the oxide layer SIO is thicker than the gateinsulating layer GI. In addition, as the oxide layer SIO is forcontrolling the hydrogen diffusion amount, it is preferable that theoxide layer SIO is thicker than the nitride layer SIN.

Especially, on the oxide layer SIO of the intermediate insulating layerILD, a second semiconductor layer A2 overlapping with the second gateelectrode G2 is disposed. The second semiconductor layer A2 includes thechannel area of the second thin film transistor T2. For the case thatthe second thin film transistor T2 is applied for the display element,the second semiconductor layer A2 may have characteristics proper toperform the switching element. For example, the second semiconductorlayer A2 may include an oxide semiconductor material, such as indiumgallium zinc oxide (or ‘IGZO), indium gallium oxide (or ‘IGO’), orindium zinc oxide (or ‘IZO’). The oxide semiconductor material has amerit for driving the device with relatively low frequency. Due to thesecharacteristics, the pixels may have long period for holding the pixelvoltage, and consequentially, it may be desirable to apply the displaywith a low frequency drive and/or low power consumption. For the thinfilm transistor having the oxide semiconductor material, considering thestructure in which two different type thin film transistors are formedon the same substrate, it is preferable that the oxide semiconductorthin film transistor has a bottom gate structure for ensuring thestability of the elements.

On the second semiconductor layer A2 and the intermediate insulatinglayer ILD, the source-drain electrodes are disposed. The first sourceelectrode S1 and the first drain electrode D1 are disposed facing eachother with a predetermined distance across the first gate electrode G1.The first source electrode S1 is connected to one side of the firstsemiconductor layer A1, a source area SA through a source contact holeSH. The source contact hole SH exposes the one side of the firstsemiconductor layer A1, the source area SA, by penetrating theintermediate insulating layer ILD and the gate insulating layer GI. Thefirst drain electrode D1 is connected to the other side of the firstsemiconductor layer A1, a drain area DA, through a drain contact holeDH. The drain contact hole DH exposes the other side of the firstsemiconductor layer A1, the drain area DA, by penetrating theintermediate insulating layer ILD and the gate insulating layer GI.

The second source electrode S2 and the second drain electrode D2 aredisposed facing each other with a predetermined distance across thesecond gate electrode G2, and as contacting the upper surfaces of theone side and the other side of the second semiconductor layer A2. Thesecond source electrode S2 directly contacts the upper surface of theintermediate insulating layer ILD and the one upper surface of thesecond semiconductor layer A2. The second drain electrode D2 directlycontacts the upper surface of the intermediate insulating layer ILD andthe other upper surface of the second semiconductor layer A2.

On the whole surface of the substrate SUB having the first thin filmtransistor T1 and the second thin film transistor T2, a passivationlayer PAS is deposited. Further, by patterning the passivation layerPAS, contact holes for exposing the first drain electrode D1 and/or thesecond drain electrode D2 may be included. In addition, on thepassivation layer PAS, a pixel electrode (e.g., anode electrode for theorganic light emitting diode display) may be included as connecting tothe first drain electrode D1 and/or second drain electrode D2. Here, forconvenience, the structure of the thin film transistor showing the mainfeatures of the present disclosure will be explained.

As mentioned above, the thin film transistor substrate for the flatpanel display according to the first embodiment of the presentdisclosure suggests the structure in which the first thin filmtransistor T1 has a polycrystalline semiconductor material and thesecond thin film transistor T2 has a oxide semiconductor material, onthe same one substrate SUB. Especially, the first gate electrode G1 ofthe first thin film transistor T1 and the second gate electrode G2 ofthe second thin film transistor T2 are formed on the same layer with thesame metal material.

The first semiconductor layer A1 of the first thin film transistor T1having the polycrystalline semiconductor material is disposed under thefirst gate electrode G1, but the second semiconductor layer A2 of thesecond thin film transistor T2 having the oxide semiconductor materialis disposed over the second gate electrode G2. The first semiconductorlayer A1 which may be manufactured under the relatively highertemperature condition is formed first. After that, the secondsemiconductor layer A2, which may be manufactured under the relativelylower temperature condition, is formed. As a result, the oxidesemiconductor material is not exposed by the high temperature condition,during the whole manufacturing processes. As the first semiconductorlayer A1 is formed before forming the first gate electrode G1, the firstthin film transistor T1 has a top-gate structure. As the secondsemiconductor layer A1 is formed after forming the second gate electrodeG2, the second thin film transistor T2 has a bottom-gate structure.

Further, in the thermal treatment process for the second semiconductorlayer A2 including the oxide semiconductor material, the hydrogenationprocess for the first semiconductor layer A1 including thepolycrystalline semiconductor material can be performed, at the sametime. To do so, it is preferable that the intermediate insulating layerILD includes two stacked layers as disposing an oxide layer SIO over anitride layer SIN. In the view of manufacturing process, a hydrogenationmay be used for diffusing the hydrogen particles into the firstsemiconductor layer A1. Further, it is advantageous for performing athermal treatment for stabilizing the second semiconductor layer A2including the oxide semiconductor material. The hydrogenation processmay be performed after depositing the nitride layer SIN on the firstsemiconductor layer A1, and the thermal treatment may be performed afterforming the second semiconductor layer A2. According to the firstembodiment of the present disclosure, as the oxide layer SIO isdeposited between the nitride layer SIN and the second semiconductorlayer A2, the hydrogen particles can be prevented from diffusing toomuch into the second semiconductor layer A2 including the oxidesemiconductor material. Therefore, in this first embodiment of thepresent disclosure, during the thermal treatment for the oxidesemiconductor material, the hydrogenation process may be performed atthe same time.

FIG. 2 is a flow chart illustrating a method for manufacturing the thinfilm transistor substrate having two different types of thin filmtransistors according to the first embodiment of the present disclosure.

In step S100, on a substrate SUB, a buffer layer BUF is deposited. Eventhough it is not shown in figures, before depositing the buffer layerBUF, a light shield layer may be formed at desired area.

In step S110, on the buffer layer BUF, an amorphous silicon (a-Si)material is deposited. Performing the crystallization process, theamorphous silicon layer is converted into the polycrystalline silicon(poly-Si). Using a first mask process, the polycrystalline silicon layeris patterned to form a first semiconductor layer A1.

In step S120, by depositing an insulating material, such as siliconoxide, on the whole surface of the substrate SUB having the firstsemiconductor layer A1, a gate insulating layer GI is formed. The gateinsulating layer GI preferably includes the silicon oxide. Here, thegate insulating layer GI may have a thickness of 1,000 Å or more and1,500 Å or less.

In step S200, on the gate insulating layer GI, a gate metal material isdeposited. Using a second mask process, the gate metal layer ispatterned to form the gate electrodes. Especially, a first gateelectrode G1 for the first thin film transistor T1 and a second gateelectrode G2 for the second thin film transistor T2 are formed at thesame time. The first gate electrode G1 is disposed as overlapping withthe middle portion of the first semiconductor layer A1. The second gateelectrode G2 is disposed where the second thin film transistor T2 isformed.

In step S210, using the first gate electrode G1 as a mask, impuritymaterials are doped into some portions of the first semiconductor layerA1 so that doping areas including a source area SA and a drain area DAmay be defined. The detailed manufacturing process for the doping areasmay be a little bit different according to the types of thin filmtransistor (e.g., P-MOS type, N-MOS type and/or C-MOS type). Forexample, for the N-MOS type, a high density doping area may be formedfirst, and then a low density doping area may be formed. Using thephoto-resist pattern for the first gate electrode G1, which has a widersize than the first gate electrode G1, the high density doping area canbe defined. Removing the photo-resist pattern and using the first gateelectrode G1 as a mask, the low density doping area (or, ‘LDD’) can bedefined between the high density doping area and the first gateelectrode G1. The impurity doping areas are not shown in figures, forconvenience.

In step S220, on the whole surface of the substrate SUB having the firstgate electrode G1 and the second gate electrode G2, an intermediateinsulating layer ILD is deposited. Especially, a nitride layer SIN isfirstly deposited and then an oxide layer SIO is sequentially depositedthereon. The nitride layer SIN includes a lot of hydrogen particlesduring the depositing process. Considering the manufacturing process,the total thickness of the intermediate insulating layer ILD may have athickness of 2,000 Å˜6,000 Å. Here, for the nitride layer SIN of whichpurpose is the diffusion of the hydrogen particles, considering thehydrogenation efficiency, it preferably has the thickness of 1,000Å˜3,000 Å. As the oxide layer SIO is for preventing the hydrogenparticle from diffusing too much into the semiconductor layer disposedover the oxide layer SIO, it may have a thickness of 1,000 Å˜3,000 Å.Considering the hydrogen diffusion efficiency and the elementproperties, the thicknesses of the oxide layer SIO and the nitride layerSIN may be selected and/or decided. For example, to prevent the hydrogenparticles from diffusing out too much, the nitride layer SIN ispreferably thinner than the oxide layer SIO.

In step S300, on the intermediate insulating layer ILD, especially onthe oxide layer SIO, an oxide semiconductor material is deposited.Further, the oxide semiconductor material may be deposited directly onthe oxide layer SIO so that the oxide semiconductor material does notdirectly contact the nitride layer SIN including the hydrogen particlesa lot. The oxide semiconductor material includes at least one of IndiumGallium Zinc Oxide (or ‘IGZO), Indium Gallium Oxide (or ‘IGO’), andIndium Zinc Oxide (or ‘IZO). Using a third mask process, the oxidesemiconductor material is patterned to form a second semiconductor layerA2. The second semiconductor layer A2 is disposed as overlapping withthe second gate electrode G2.

In step S310, performing a post-thermal process to the substrate SUBhaving the second semiconductor layer A2, the hydrogenation for thefirst semiconductor layer A1 including the polycrystalline silicon andthe thermal treatment for the second semiconductor layer A2 includingthe oxide semiconductor material are performed at the same time. Thepost-thermal process may be performed under a 350˜380° C. temperaturecondition. At this time, a large amount of the hydrogen particlesincluded in the nitride layer SIN would be diffused into the firstsemiconductor layer A1. However, the amount of the hydrogen particlesdiffused into the second semiconductor layer A2 may be restricted and/orcontrolled by the oxide layer SIO. In some cases, the hydrogenationprocess for the first semiconductor layer A1 is performed separatelyfrom the thermal treatment for the second semiconductor layer A2. Inthese cases, the hydrogenation process is first performed after stepS220 for depositing the intermediate insulating layer ILD, and then thethermal treatment for the second semiconductor layer A2 is performed bythis post-thermal process.

In step S400, using a fourth mask process, the intermediate insulatinglayer ILD and the gate insulating layer GI are patterned to form asource contact hole SH exposing the one portion of the firstsemiconductor layer A1 and a drain contact hole DH exposing the otherportion of the first semiconductor layer A1. These contact holes SH andDH are for later connecting the source-drain electrode to the firstsemiconductor layer A1.

Here, steps S300, S310, and S400 may be changed in sequential order inaccordance with the manufacturing conditions. For example, step S400 forforming the contact holes may be performed first, step S300 for formingthe second semiconductor layer A2 may be performed second, and then ofS310 for performing the post-thermal treatment may be performed finally.Otherwise, step S300 for forming the second semiconductor layer A2 maybe performed first, step S400 for forming the contact holes may beperformed second, then step S310 for performing the post-thermaltreatment may be performed finally.

In step S500, a source-drain metal material is deposited on theintermediate layer ILD having the source contact hole SH, the draincontact hole DH and the second semiconductor layer A2. Using a fifthmask process, the source-drain metal material is patterned to form afirst source electrode S1, a first drain electrode D1, a second sourceelectrode S2 and a second drain electrode D2. The first source electrodeS1 contacts the one area of the first semiconductor layer A1, the sourcearea SA, through the source contact hole SH. The first drain electrodeD1 contacts another area of the first semiconductor layer A1, the drainarea DA, through the drain contact hole DH. The second source electrodeS2 contacts the upper surface of one side of the second semiconductorlayer A2. The second drain electrode D2 contacts the upper surface ofthe other side of the second semiconductor layer A2.

In step S600, on the whole surface of the substrate SUB having thesource-drain electrodes, a passivation layer PAS is deposited. Eventhough not shown in figures, the passivation layer PAS may be patternedto form contact holes for exposing some portions of the first and/orsecond drain electrodes D1 and/or D2.

Second Embodiment

FIG. 3 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttypes of thin film transistors are formed according to a secondembodiment of the present disclosure.

The thin film transistor substrate according to the second embodiment issimilar to that of the first embodiment. In the second embodiment, thesource-drain electrode S2-D2 and the second semiconductor layer A2 ofthe second thin film transistor T2 are formed at the same time duringthe same mask process. As a result, in the view of the structure, thesecond semiconductor materials SE2 exist under the first source-drainelectrodes S1-D1 of the first thin film transistors T1, while the secondsemiconductor layer A2 (the same material with the second semiconductormaterials SE2) exists under the second source-drain electrodes S2-D2 ofthe second thin film transistor T2.

For the second thin film transistor T2, the second source electrode S2and the second drain electrode D2 have the same outer peripheral shapewith the second semiconductor layer A2 having the oxide semiconductormaterial. The second source electrode S2 and the second drain electrodeD2 are separated from each other by a predetermined distancecorresponding to a space of a channel area defined at a middle portionof the second semiconductor layer A2. That is, the second sourceelectrode S2 is disposed on one side surface of the second semiconductorlayer A2 having the oxide semiconductor material. The second drainelectrode D2 is disposed on the other side of the second semiconductorlayer A2.

In the interim, for the first thin film transistor T1, the secondsemiconductor materials SE2 having the oxide semiconductor material areinserted between the first source electrode Si and the intermediateinsulating layer ILD and between the first drain electrode D1 and theintermediate insulating layer ILD, as the dummy layers. Specifically,the first source electrode S1 may contact the source area SA, one sidearea of the first semiconductor layer A1, through the source contacthole SH penetrating the second semiconductor material SE2, theintermediate insulating layer ILD and the gate insulating layer GI. Likethat, the first drain electrode D1 may contact the drain area DA, theother side area of the first semiconductor layer A1, through the draincontact hole DH penetrating the second semiconductor material SE2, theintermediate insulating layer ILD and the gate insulating layer GI.

Further, in the second embodiment as illustrated and describe, theintermediate insulating layer ILD is shown and explained as a singlelayer for convenience. For example, the intermediate insulating layerILD may be a single layer made of an oxide silicon (SiOx) material.Otherwise, the intermediated insulating layer ILD may have a doublelayered structure in which an oxide silicon (SiOx) layer is stacked on anitride silicon (SiNx) layer. Because the structure of the intermediateinsulating layer ILD is explain with regard to the first embodiment, afurther description is omitted here.

The intermediate layer ILD also acts as a gate insulating layer for thesecond thin film transistor T2. Therefore, when the intermediate layerILD is too thick, the gate voltage may not be properly applied to thesecond semiconductor layer A2. Therefore, the whole thickness of theintermediate layer ILD may have the thickness of 2,000 Å˜6,000 Å.

As other elements are similar with those of the first embodiment, adetailed explanation thereof will be omitted. Hereinafter, withreference to FIGS. 4 and 5A to 5F, a method for manufacturing the thinfilm transistor substrate for flat panel display according to the secondembodiment of the present disclosure will be explained. Herein, theduplicative explanation will be omitted. FIG. 4 is a flow chartillustrating a method for manufacturing the thin film transistorsubstrate for a flat panel display in which two different types of thinfilm transistors are formed according to the second embodiment of thepresent disclosure. FIGS. 5A to 5F are cross sectional viewsillustrating the steps for manufacturing the thin film transistorsubstrate for a flat panel display in which two different types of thinfilm transistors are formed according to the second embodiment of thepresent disclosure.

In step S100, on a substrate SUB, a buffer layer BUF is deposited.

In step S110, on the buffer layer BUF, a first semiconductor materialSE1 having an amorphous silicon (a-Si) material is deposited. Byperforming a crystallization process, the amorphous silicon material isconverted into a polycrystalline silicon (poly-Si) material. Using afirst mask process, the first semiconductor material SE1 having thepolycrystalline silicon material is patterned to form a firstsemiconductor layer A1.

In step S120, depositing an insulating material such as an silicon oxideon the whole surface of the substrate SUB having the first semiconductorlayer A1, a gate insulating layer GI is formed. The gate insulatinglayer GI may be made of silicon oxide with a thickness of 1,000 A˜1,500Å, as shown in FIG. 5A.

In step S200, on the gate insulating layer GI, a gate metal layer isdeposited. Using a second mask process, the gate metal layer ispatterned to form the gate electrodes. Here, a first gate electrode G1for the first thin film transistor T1 and a second gate electrode G2 forthe second thin film transistor T2 are formed at the same time. Thefirst gate electrode G1 is disposed to overlap a middle portion of thefirst semiconductor layer A1. The second gate electrode G2 is disposedwhere the second thin film transistor T2 is formed.

In step S210, using the first gate electrode G1 as a mask, impuritymaterials are doped into portions of the first semiconductor layer A1 sothat the doped areas define a source area SA and a drain area DA.

In step S220, on the whole surface of the substrate SUB having the firstgate electrode G1 and the second gate electrode G2, an intermediateinsulating layer ILD is deposited, as shown in FIG. 5B. Even though itis not shown in figures here, the intermediate insulating layer ILD mayhave a stacked structure in which the oxide layer is deposited on thenitride layer, in a manner similar to that of the first embodiment. Thethicknesses of the oxide layer and the nitride layer may be selectedand/or decided in consideration of the hydrogen diffusion efficiency andthe element properties. For example, to prevent the hydrogen particlesfrom diffusing out too much, the nitride layer may be thinner than theoxide layer.

In step S300, on the intermediate insulating layer ILD, a secondsemiconductor material SE2 having an oxide semiconductor material isdeposited. If the intermediate insulating layer ILD has a stackedstructure in which the oxide layer SIO is deposited on the nitride layerSIN, the second semiconductor material SE2 having the oxidesemiconductor material may be deposited directly on the oxide layer SIOto avoid contacting the nitride layer SIN having a lot of hydrogen.

In step S310, performing a post-thermal process to the substrate SUBhaving the second semiconductor layer A2, the hydrogenation for thefirst semiconductor layer A1 including the polycrystalline silicon andthe thermal treatment for the second semiconductor layer A2 includingthe oxide semiconductor material are performed at the same time. Thepost-thermal process may be performed at a temperature condition of350˜380° C. If the oxide layer is stacked on the nitride layer for theintermediate insulating layer ILD, a large amount of the hydrogenparticles included into the nitride layer SIN may diffuse into the firstsemiconductor layer A1. However, the amount of the hydrogen particlesdiffused into the second semiconductor layer A2 may be restricted and/orcontrolled by the oxide layer SIO disposed at the upper layer of thenitride layer SIN. In some cases, the hydrogenation process for thefirst semiconductor layer A1 may be performed separately from thethermal treatment for the second semiconductor layer A2.

In step S320, using a third mask process, the second semiconductormaterial SE2, the intermediate insulating layer ILD and the gateinsulating layer GI are patterned to form a source contact hole SH and adrain contact hole DH exposing one side portion and the other sideportion of the first semiconductor layer A1, respectively, as shown inFIG. 5C.

In step S400, a source-drain metal material SD is deposited on theintermediate insulating layer ILD. Most portions of the source-drainmetal SD are stacked on the second semiconductor material SE2. Further,via the source contact hole SH, the source-drain metal SD contacts thesource area SA, which is defined at a side portion of the firstsemiconductor layer A1. Also, via the drain contact hole DH, thesource-drain metal SD contacts the drain area SA, which is defined atthe other side portion of the first semiconductor layer A1.

After that, using a fourth mask process, the source-drain metal SD andthe second semiconductor material SE2 are patterned at the same time toform a first source electrode S and the first drain electrode D1, thesecond source electrode S2 and the second drain electrode D2 and thesecond semiconductor layer A2. In the fourth mask process, a half-tonemask may be used for etching two stacked layers in the differentthicknesses to form the source-drain electrodes and the semiconductorlayer at the same time. Hereinafter, the fourth mask process using thehalf-tone mask will be explained.

On the source-drain metal SD, a photo resist PR is coated. Using thehalf-tone mask, the photo resist PR is patterned. For example, for thesecond thin film transistor, the photo resist PR may be patterned as thefull-tone FT may be applied to the area corresponding to the sourceelectrode and the drain electrode, and the half-tone may be applied tothe area corresponding to the channel area of the second semiconductorlayer. At that time, for the first thin film transistor, the full-toneis also applied to the area corresponding to the source electrode andthe drain electrode, as shown in FIG. 5D.

Using the photo resist pattern, the source-drain metal SD and the secondsemiconductor material SE2 are patterned at the same time to form thefirst source electrode S1 and the first drain electrode D1, the secondsource electrode S2 and the second drain electrode D2, and the secondsemiconductor layer A2. The first source electrode S1 contacts thesource area SA of the first semiconductor layer A1 through the sourcecontact hole SH (labeled in FIG. 5C). The source contact hole SHpenetrates the second semiconductor material SE2, the intermediateinsulating layer ILD and the gate insulating layer GI. As the result,the second semiconductor material SE2 is inserted between the firstsource electrode S1 and the intermediate insulating layer ILD. Further,the first drain electrode D1 contacts the drain area DA of the firstsemiconductor layer A1 through the drain contact hole DH. The draincontact hole DH penetrates the second semiconductor material SE2, theintermediate insulating layer ILD and the gate insulating layer GI. Asthe result, the second semiconductor material SE2 is also insertedbetween the first drain electrode D1 and the intermediate insulatinglayer ILD.

In step S410, the second source electrode S2 and the second drainelectrode D2 have the same outer circumference contour profile with thesecond semiconductor layer A2. Further, the second source electrode S2and the second drain electrode D2 are separated each other with apredetermined distance there-between. That is, the channel area (i.e.,the middle portion of the second semiconductor layer A2) is not coveredby the source-drain metal but is instead exposed. Here, the secondsemiconductor layer A2 overlaps the second gate electrode G2, as shownin FIG. 5E.

In step S500, on the whole surface of the substrate SUB having the firstthin film transistor T1 and the second thin film transistor T2, apassivation layer PAS is deposited, as shown in FIG. 5F.

Here, step S310 for the hydrogenation process and the thermal treatmentmay be conducted at any time between step S300 for depositing the secondsemiconductor material and step S500 for depositing the passivationlayer in accordance with desired manufacturing conditions and/orcircumstances. For example, step S310 may be conducted after step S320for forming the contact holes, or after step S400 for depositing thesource-drain metal. Otherwise, step S310 may be conducted after stepS410 for forming the source-drain and the second semiconductor layer.

As compared with the first embodiment, the method for manufacturing thethin film transistor substrate according to the second embodiment of thepresent disclosure has a reduction of one of mask process. That is, thethin film transistor substrate according to the second embodiment mayhave the same advantages as the first embodiment as well as having afurther merit of a reduction of mask processes.

Third Embodiment

FIG. 6 is a cross sectional view illustrating a structure of a thin filmtransistor substrate for a flat panel display in which two differenttypes of thin film transistors are formed, according to a thirdembodiment of the present disclosure.

The thin film transistor substrate according to the third embodiment isvery similar that of the first embodiment and/or the second embodiment.However, in the third embodiment, the first gate electrode G1 of thefirst thin film transistor T1 and the second gate electrode G2 of thesecond thin film transistor T2 may be disposed at different layers fromeach other. Further, because the first and the second gate electrodes G1and G2 are disposed on different layers, the intermediate insulatinglayer ILD has a two layered structure.

In detail, the intermediate insulating layer ILD comprises a firstintermediate insulating layer ILD1 and the second intermediateinsulating layer ILD2. The first intermediate insulating layer ILD1 isdeposited on the first gate electrode G1 as covering the area where thefirst thin film transistor T1 and the second thin film transistor T2 aredisposed. The second gate electrode G2 is disposed on the firstintermediate insulating layer ILD1. The second intermediate insulatinglayer ILD2 is deposited on the second gate electrode G2 to cover an areawhere the first thin film transistor T1 and the second thin filmtransistor T2 are disposed.

The first intermediate insulating layer ILD1 may include a material,such as a silicon nitride SiNx, having a sufficient amount of hydrogenparticles such that the hydrogen particles are diffused into the firstsemiconductor layer A1 of the first thin film transistor T1. In theinterim, the second intermediate insulating layer ILD2 acts as a gateinsulating layer as stacked on the second gate electrode G2. Further, onthe second intermediate insulating layer ILD2, the second semiconductorlayer A2 of the second thin film transistor T2 is disposed. Therefore,it is desired that not too much amount of the hydrogen particlesincluded into the first intermediate insulating layer ILD1 diffuse intothe second semiconductor layer A2 during the thermal treatment. That is,the second intermediate insulating layer ILD2 may include a material,such as a silicon oxide SiOx, having almost no hydrogen particles.

While not shown in figures, the first intermediate insulating layer(ILD1) may have a double layered structure in which the nitride layer isstacked on a lower oxide layer. In that case, the nitride layer may notcover the second area where the second thin film transistor T2 isdisposed, but cover only the first area where the first thin filmtransistor T1 is disposed.

Considering the hydrogenation efficiency, the first intermediateinsulating layer ILD1 made of the silicon nitride may have a thicknessof 1,000 Å˜3,000 Å. Considering the efficiency for preventing thehydrogen particles from diffusing too much and the function of the gateinsulating layer for the second semiconductor layer T2, the secondintermediate insulating layer ILD2 made of the silicon oxide may have athickness of 1,000 Å˜3,000 Å.

As explained with reference to the second embodiment, the secondsource-drain electrodes S2-D2 of the second thin film transistor T2 areformed with the second semiconductor layer A2 at the same time. Further,the first source-drain electrodes S1-D1 of the first thin filmtransistor T1 are formed with the second source-drain electrodes S2-D2of the second thin film transistor T2, at the same time. As a result, inthe view of the structure, the second semiconductor materials SE2 existunder the first source-drain electrodes S1-D1 of the first thin filmtransistors T1, while the second semiconductor layer A2 (the samematerial with the second semiconductor materials SE2) exists under thesecond source-drain electrodes S2-D2 of the second thin film transistorT2.

As other elements are similar to those of the second embodiment, adetailed explanation will be omitted. Hereinafter, with reference toFIG. 7, a method for manufacturing the thin film transistor substratefor flat panel display according to the third embodiment of the presentdisclosure will be explained. FIG. 7 is a flow chart illustrating amethod for manufacturing the thin film transistor substrate for a flatpanel display in which two different types of thin film transistors areformed according to the third embodiment of the present disclosure.

In step S100, on a substrate SUB, a buffer layer BUF is deposited.

In step S110, on the buffer layer BUF, a first semiconductor materialSE1 having an amorphous silicon (a-Si) material is deposited. Byperforming a crystallization process, the amorphous silicon material isconverted into a polycrystalline silicon (poly-Si) material. Using afirst mask process, the first semiconductor material SE1 having thepolycrystalline silicon material is patterned to form a firstsemiconductor layer A1.

In step S120, a gate insulating layer GI is formed by depositing aninsulating material, such as a silicon oxide, and then depositing aninsulating material, such as an silicon, oxide on the whole surface ofthe substrate SUB having the first semiconductor layer A1. The gateinsulating layer GI may include a silicon oxide layer having a thicknessof 1,000 Å˜1,500 Å.

In step S200, on the gate insulating layer GI, a gate metal layer isdeposited. Using a second mask process, the gate metal layer ispatterned to form a first gate electrode G1 for the first thin filmtransistor T1. The first gate electrode G1 overlaps a middle portion ofthe first semiconductor layer A1.

In step S210, using the first gate electrode G1 as a mask, impuritymaterials are doped into some portions of the first semiconductor layerA1 so that the doped areas define a source area SA and a drain area DA.

In step S220, on the whole surface of the substrate SUB having the firstgate electrode G1, a first intermediate insulating layer ILD1 isdeposited. While not shown in figures, the first intermediate insulatinglayer ILD1 may have the stacked structure in which a oxide layer isdeposited on a nitride layer in a manner similar to that described withreference to the first embodiment. The thicknesses of the oxide layerand the nitride layer may be selected and/or decided in consideration ofthe hydrogen diffusion efficiency and the element properties. Forexample, to prevent the hydrogen particles from diffusing out too much,the nitride layer may be thinner than the oxide layer.

In step S300, on the first intermediate insulating layer ILD1, a gatemetal layer is further deposited. Using a third mask process, the gatemetal layer is patterned to form a second gate electrode G2. The secondgate electrode G2 is disposed where the second thin film transistor T2is formed.

In step S400, using an oxide inorganic material such as a silicon oxideSiOx, a second intermediate insulating layer ILD2 is deposited on thewhole surface of the substrate SUB having the second gate electrode G2.

In step S410, on the second intermediate insulating layer ILD2, a secondsemiconductor material SE2 having an oxide semiconductor material isdeposited. The second intermediate insulating layer ILD2 and the secondsemiconductor material SE2 can be stacked by the sequential depositingprocess.

In step S420, by applying a post-thermal process to the substrate SUBhaving the second semiconductor material SE2, the hydrogenation for thefirst semiconductor layer A1 including the polycrystalline silicon andthe thermal treatment for the second semiconductor material SE2including the oxide semiconductor material are performed at the sametime. The post-thermal process may be performed at a temperature of350˜380° C. A large amount of the hydrogen particles included in thefirst intermediate insulating layer ILD1 will diffuse into the firstsemiconductor layer A1. However, the amount of the hydrogen particlesdiffused into the second semiconductor material SE2 may be restrictedand/or controlled by the second intermediate insulating layer ILD2having almost no hydrogen particles. In some cases, the hydrogenationprocess for the first semiconductor layer A1 may be performed separatelyfrom the thermal treatment for the second semiconductor material SE2.

In step S430, using a fourth mask process, the second semiconductormaterial SE2, the second intermediate insulating layer ILD2, the firstintermediate insulating layer ILD1 and the gate insulating layer GI arepatterned to form a source contact hole SH and a drain contact hole DHexposing one side portion and the other side portion of the firstsemiconductor layer A1, respectively.

In step S500, a source-drain metal material SD is deposited on thesecond intermediate insulating layer ILD2. Most portions of allsource-drain metal material SD are stacked on the second semiconductormaterial SE2. Further, via the source contact hole SH, the source-drainmetal material SD contacts the source area SA, one side portion of thefirst semiconductor layer A1. And, via the drain contact hole DH, thesource-drain metal material SD contacts the drain area SA, the otherside portion of the first semiconductor layer A1.

After that, using a fifth mask process, the source-drain metal materialSD and the second semiconductor material SE2 are patterned at the sametime to form a first source electrode S1 and the first drain electrodeD1, the second source electrode S2 and the second drain electrode D2 andthe second semiconductor layer A2. In this fifth mask process, ahalf-tone mask may be used for etching two stacked layers in thedifferent thicknesses to form the source-drain electrodes and thesemiconductor layer at the same time. As the same half-tone mask processas explained in the second embodiment may be used, the explanation ofthe half-tone mask process is not explained here.

In step S600, on the whole surface of the substrate SUB having the firstthin film transistor T1 and the second thin film transistor T2, apassivation layer PAS is deposited.

Here, step S420 for the hydrogenation process and the thermal treatmentmay be conducted at any time between the step of S410 for depositing thesecond semiconductor material and the step of S600 for depositing thepassivation layer, in convenience of manufacturing conditions and/orcircumstances. For example, the step of S420 may be conducted after thestep of S430 for forming the contact holes, or after the step of S500for depositing the source-drain metal. Otherwise, step S420 may beconducted after the step of S510 for forming the source-drain and thesecond semiconductor layer.

In the method for manufacturing the thin film transistor substrateaccording to the third embodiment of the present disclosure, as thefirst gate electrode G1 and the second gate electrode G2 are formed indifferent layers, one more mask process may be needed as compared withthe first embodiment. However, as the second semiconductor layer A2, thesecond source electrode S2 and the second drain electrode D2 are formedusing one mask process, the total number of the mask processes in thethird embodiment is the same with that of the first embodiment. As theresults, the third embodiment has the advantage that the characteristicsof two different types of the thin film transistors are stabilized onthe same substrate without increasing of the number of the maskprocesses.

First Application Example

The thin film transistor substrate having two different type thin filmtransistors on the same substrate, above explained, can be applied tovarious type display including the flat panel display, the flexibledisplay and/or the curved display. By forming the different two types ofthin film transistors on the same substrate, various advantages can beachieved. FIG. 8 is a block diagram illustrating a structure of thedisplay according to a first application example of the presentdisclosure. With reference to FIG. 8, advanced features and meritsexpects from the thin film substrate according to a first applicationexample of the present invention will be explained.

The first and the second transistors T1 and T2 would be formed in eachpixel of the display panel 100 for switching the data voltage applied tothe pixel or for driving the pixel. In the case of an organic lightemitting diode display, the second thin film transistor T2 may be aswitch element for the pixel, and the first thin film transistor T1 maybe a driver element. In the interim, by combining the first and thesecond thin film transistors T1 and T2, they may be applied to oneswitch element or one driver element.

For a mobile device or a wearable device, in order to reduce the powerconsumption, the lower speed driving method using a low frame rate isadopted. In this case, the frame frequency may be lowered for stillimage and/or images having a slower update interval. Here, when usingthe lower frame rate, at every time for changing the data voltage, thebrightness of the display may be flashed. In some cases, as thedischarging time interval is elongated, the brightness may be flickeredat every data update period. By applying the first and the second thinfilm transistors T1 and T2 according to the present disclosure, theflicker problem at lower speed driving method can be prevented.

In the lower speed driving method, as the data update period iselongated, the leaked current amount of the switching thin filmtransistor may be increased. The leaked current of the switching thinfilm transistor may cause a voltage drop down of the storage capacitanceand the drop down of the voltage between gate and source. The secondthin film transistor having the oxide semiconductor material can beapplied to the switch thin film transistor of the organic light emittingdiode display. Because the thin film transistor including the oxidesemiconductor material has lower off-current characteristics, thevoltage drop down of the storage capacitance and/or of the gateelectrode of the driving thin film transistor is prevented. The flickerphenomenon does not occur when using the lower speed driving method.

As polycrystalline silicon has characteristics of high mobility, byapplying the first thin film transistor to the driving thin filmtransistor of the organic light emitting diode display, the currentamount supplied to the organic light emitting diode can be enlarged.Therefore, by applying the second thin film transistor T2 to theswitching thin film transistor and the first thin film transistor T1 tothe driving thin film transistor, the organic light emitting diodedisplay can achieve lower power consumption and better video quality.

As the thin film transistor substrate according to the presentdisclosure has excellent video quality without flickers even though thelower speed driving method is applied, it has a merit of being verysuitable for applying to the mobile display or the wearable display. Forthe example of wearable wrist watch, the video data may be updated atevery one second for reducing the power consumption. In that case, theframe frequency is 1 Hz. Using the arrangement of the presentdisclosure, excellent video quality without flickering can be achievedeven though the video data is driven with lower frequency, such as 1 Hzor less. Further, for the mobile display or the wearable display, theframe rate for the still image can be remarkably lowered, so that thepower consumption can be saved without any degradation of the videoquality. As the result, the video quality of the mobile display and/orwearable display, and the life time of the battery can be elongated. Inaddition, the present disclosure can be applied to the electric bookdevice (or ‘E-Book’) of which data update period is very long, withoutany degradation of the video quality.

At least one of the first and the second thin film transistors T1 and T2may be embedded into a driver IC, for example shown in FIG. 8, e.g., anyone of the data driver IC 200, the multiplexer (or ‘MUX’) 210, and thegate driver IC 300, for forming the driver IC. This driver IC writesand/or applies the data voltage to the pixel. In another case, any oneof the first and the second thin film transistors T1 and T2 is disposedwithin the pixel, and the other is disposed in the driver IC. The datadriver IC 200 converts the input video data into the voltage values andoutput the voltage values. The multiplexer 210 may reduce the number ofthe output channel of the data driver 200, by distributing the datavoltages from the data driver 200 to the data lines DL by time-sharingor time-division method. The gate driver IC 300 outputs the scan signal(or ‘gate signal’) to the gate line GL synchronized to the data voltagefor sequentially selecting the pixel line where the data voltage isapplied. In order to reduce the output channel number of the gate driverIC 300, other multiplexers not shown in the figures may be furtherincluded between the gate driver IC 300 and the gate line GL. Themultiplexer 210 and the gate driver IC 300 may be formed on the samethin film transistor substrate within the pixel array, as shown in FIG.8. The multiplexer 210 and the gate driver IC 300 may be disposed withinthe non-display area NA and the pixel array may be disposed within thedisplay area AA, as shown in FIG. 8.

The thin film transistor substrate according to the present disclosuremay be applied to any type of active type display using an active matrixthin film transistor substrate such as the liquid crystal display, theorganic light emitting diode display and/or the electrophoresis displaydevice. Hereinafter, more application examples for the display using thethin film transistor substrate according to the present disclosure willbe explained.

Second Application Example

FIG. 9 is a plane view illustrating a thin film transistor substratehaving an oxide semiconductor layer included in a fringe field typeliquid crystal display according to a second application example of thepresent disclosure. FIG. 10 is a cross-sectional view illustrating thestructure of the thin film transistor substrate of FIG. 9 by cuttingalong line I-I′ according to the second application example of thepresent disclosure.

The thin film transistor substrate having a metal oxide semiconductorlayer shown in FIGS. 9 and 10 comprises a gate line GL and a data lineDL crossing each other with a gate insulating layer GI there-between ona lower substrate SUB, and a thin film transistor T formed at eachcrossing portion. By the crossing structure of the gate line GL and thedata line DL, a pixel area is defined.

The thin film transistor T comprises a gate electrode G branched (or‘extruded’) from the gate line GL, a source electrode S branched fromthe data line DL, a drain electrode D facing the source electrode S, anda semiconductor layer A overlapping with the gate electrode G on thegate insulating layer GI for forming a channel area between the sourceelectrode S and the drain electrode D.

At one end of the gate line GL, a gate pad GP is disposed for receivingthe gate signal. The gate pad GP is connected to a gate pad intermediateterminal IGT through the first gate pad contact hole GH1 penetrating thegate insulating layer GI. The gate pad intermediate terminal IGT isconnected to the gate pad terminal GPT through the second gate padcontact hole GH2 penetrating the first passivation layer PA1 and thesecond passivation layer PA2. Further, at one end of the data line DL, adata pad DP is disposed for receiving the pixel signal. The data pad DPis connected to a data pad terminal DPT through the data pad contacthole DPH penetrating the first passivation layer PA1 and the secondpassivation layer PA2.

In the pixel area, a pixel electrode PXL and a common electrode COM areformed with the second passivation layer PA2 there-between, to form afringe electric field. The common electrode COM is connected to thecommon line CL disposed in parallel with the gate line GL. The commonelectrode COM is supplied with a reference voltage (or “common voltage”)via the common line CL. For other cases, the common electrode COM hasthe one sheet electrode shape that covers the whole surface of thesubstrate SUB except the drain contact hole DH portions. That is,covering over the data line DL, the common electrode COM can work as ashield for the data line DL.

The common electrode COM and the pixel electrode PXL can have variousshapes and positions according to the design purpose and environment.While the common electrode COM is supplied with a reference voltagehaving constant value, the pixel electrode PXL is supplied with a datavoltage varying timely according to the video data. Therefore, betweenthe data line DL and the pixel electrode PXL, a parasitic capacitancemay be formed. Due to the parasitic capacitance, the video quality ofthe display may be degraded. Therefore, it is preferable that the commonelectrode COM is disposed at the lower layer and the pixel electrode PXLis disposed at the topmost layer.

In other words, on the first passivation layer PA1 covering the dataline DL and the thin film transistor T, a planarization layer PAC isstacked thereon by thickly depositing an organic material having a lowpermittivity. Then, the common electrode COM is formed. And then, afterdepositing the second passivation layer PA2 to cover the commonelectrode COM, the pixel electrode PXL overlapping with the commonelectrode is formed on the second passivation layer PA2. In thisstructure, the pixel electrode PXL is far from the data line DL by thefirst passivation layer PA1, the planarization layer PAC and the secondpassivation layer PA2, so that it is possible to reduce the parasiticcapacitance between the data line DL and the pixel electrode PXL. Inother case, the pixel electrode PXL may be disposed at the lower layerand the common electrode COM is disposed at the topmost layer.

The common electrode COM may have a rectangular shape corresponding tothe pixel area. The pixel electrode PXL may have the shape of aplurality of segments. Especially, the pixel electrode PXL is verticallyoverlapped with the common electrode COM with the second passivationlayer PA2 there-between. Between the pixel electrode PXL and the commonelectrode COM, the fringe electric field is formed. By this fringeelectric field, the liquid crystal molecules arrayed in plane directionbetween the thin film transistor substrate and the color filtersubstrate may be rotated according to the dielectric anisotropy of theliquid crystal molecules. According to the rotation degree of the liquidcrystal molecules, the light transmittance ratio of the pixel area maybe changed so as to represent desired gray scale.

In FIGS. 9 and 10 for explaining the second application example of thepresent disclosure, in convenience, the thin film transistor T of theliquid crystal display is shown briefly. The first and/or the secondthin film transistors T1 and/or T2 explained from the first to thirdembodiments of the present disclosure can be applied to this thin filmtransistor. In one example, for a low speed driving, the second thinfilm transistor T2 having the oxide semiconductor material can beapplied to the thin film transistor T. In another example, for low powerconsumption, the first thin film transistor T1 having thepolycrystalline semiconductor material may be applied to the thin filmtransistor T. In still other example, the thin film transistor T may beformed as including the first and the second thin film transistors T1and T2 and they are connected so that their performance andcharacteristics can compensate each other.

Third Application Example

FIG. 11 is a plane view illustrating the structure of one pixel for theactive matrix type organic light emitting diode display having activeswitching elements, such as thin film transistors, according to a thirdapplication example of the present disclosure. FIG. 12 is a crosssectional view illustrating the structure of the organic light emittingdiode display along cutting line II-IF in FIG. 11 according to the thirdapplication example of the present disclosure.

With reference to FIGS. 11 and 12, the active matrix type organic lightemitting diode display comprises a switching thin film transistor ST, adriving thin film transistor DT connected to the switching thin filmtransistor ST, and an organic light emitting diode OLE connected to thedriving thin film transistor DT.

The switching thin film transistor ST is formed where a gate line GL anda data line DL are crossing each other, on a substrate SUB. Supplyingthe data voltage from the data line DL to the gate electrode DG of thedriving thin film transistor DT and to the storage capacitance STGreplying the scan signal, the switching thin film transistor ST acts forselecting the pixel which is connected to the switching thin filmtransistor ST. The switching thin film transistor ST includes a gateelectrode SG branching from the gate line GL, a semiconductor channellayer SA overlapping with the gate electrode SG a source electrode SSand a drain electrode SD. Controlling the amount of the current appliedto the organic light emitting diode OLE of the pixel according to thegate voltage, the driving thin film transistor DT acts for driving theorganic light emitting diode OLE disposed at the pixel selected by theswitching thin film transistor ST.

The driving thin film transistor DT includes a gate electrode DGconnected to the drain electrode SD of the switching thin filmtransistor ST, a semiconductor channel layer DA, a source electrode DSconnected to the driving current line VDD, and a drain electrode DD. Thedrain electrode DD of the driving thin film transistor DT is connectedto the anode electrode ANO of the organic light emitting diode OLE.Between the anode electrode ANO and the cathode electrode CAT, anorganic light emitting layer OL is disposed. The cathode electrode CATis connected to the ground line Vss.

With more detailed reference to FIG. 12, on the substrate SUB of theactive matrix organic light emitting diode display, the gate electrodesSG and DG of the switching thin film transistor ST and the driving thinfilm transistor DT, respectively are disposed. On the gate electrodes SGand DG the gate insulator GI is deposited. On the gate insulator GIoverlapping with the gate electrodes SG and DG the semiconductor layersSA and DA are disposed, respectively. On the semiconductor layer SA andDA, the source electrodes SS and DS and the drain electrodes SD and DDfacing and separated from each other, respectively, are disposed. Thedrain electrode SD of the switching thin film transistor ST is connectedto the gate electrode DG of the driving thin film transistor DT via thedrain contact hole DH penetrating the gate insulator GI. The passivationlayer PAS is deposited on the substrate SUB having the switching thinfilm transistor ST and the driving thin film transistor DT.

A color filer CF is disposed at the area where the anode electrode ANOis disposed. The color filter CF may have as large of an area aspossible. For example, it may be desired to overlap with some portionsof the data line DL, the driving current line VDD and/or the gate lineGL. The upper surface of the substrate having these thin filmtransistors ST and DT and color filters CF is not in an even and/orsmooth condition, but in uneven and/or rugged condition having manysteps. In order that the organic light emitting diode display has goodluminescent quality over the whole display area, the organic lightemitting layer OL should have an even or smooth surface. So, to make theupper surface in a planar and even condition, the planar layer PAC orthe overcoat layer OC is deposited on the whole surface of the substrateSUB.

Then, on the overcoat layer OC, the anode electrode ANO of the organiclight emitting diode OLED is disposed. Here, the anode electrode ANO isconnected to the drain electrode DD of the driving thin film transistorDT through the pixel contact hole PH penetrating the overcoat layer OCand the passivation layer PAS.

On the substrate SUB having the anode electrode ANO, a bank (or “bankpattern”) BA is disposed over the area having the switching thin filmtransistor ST, the driving thin film transistor DT and the various linesDL, GL and VDD, for defining the pixel area. The exposed portion of theanode electrode ANO by the bank BA is the light emitting area. On theanode electrode ANO exposed from the bank BA, the organic light emittinglayer OL is deposited. On the organic light emitting layer OL, thecathode electrode ACT is deposited. For the case that the organic lightemitting layer OL has a material emitting the white light, each pixelcan represent various colors by the color filter CF disposed under theanode electrode ANO. The organic light emitting diode display as shownin FIG. 12 is the bottom emission type display in which the visiblelight is radiated to the bottom direction of the display substrate.

Between the gate electrode DG of the driving thin film transistor DT andthe anode electrode ANO, a storage capacitance STG may be formed. Byconnected to the driving thin film transistor DT, the storagecapacitance STG keeps the voltage supplied to the gate electrode DG ofthe driving thin film transistor DT from the switching thin filmtransistor ST in stable condition.

Using the thin film transistor substrate like the above explanations, anactive type flat panel display having good properties can be acquired.Especially, to ensure excellent driving properties, the active layer ofthe thin film transistor may include a metal oxide semiconductormaterial.

The metal oxide semiconductor material may be degraded when it isworking exposed by the light for a long time. Therefore, the thin filmtransistor having a metal oxide semiconductor material may include astructure for blocking light from outside of the upper portion and/orthe lower portion of the thin film transistor. For example, for theabove mentioned thin film transistor substrates, it is preferable thatthe thin film transistor would be formed in the bottom gate structure.That is, the light induced from the outside of the substrate, especiallyfrom the lower side of the substrate facing the observer, can be blockedby the gate electrode G including an opaque metal material.

The thin film transistor substrate for the flat panel display has aplurality of pixel area disposed in a matrix manner. Further, each pixelarea includes at least one thin film transistor. That is, over the wholesubstrate, a plurality of thin film transistor is disposed. Theplurality of pixel area and the plurality of thin film transistor areused for the same purpose and they should have the same quality andcharacteristics, so that they have the same structure.

However, in some cases, the thin film transistors may be formed ashaving different characteristics from each other. For the example of theorganic light emitting diode display, in one pixel area, at least oneswitching thin film transistor ST and at least one driving thin filmtransistor DT are disposed. As the purposes of the switching thin filmtransistor ST and the driving thin film transistor DT are different fromeach other, the characteristics of the two are different each other aswell. To do so, the switch thin film transistor ST and the driving thinfilm transistor DT may have the same structure and the samesemiconductor material, but the channel layers of them have differentsizes for optimizing their characteristics. Otherwise, compensating thinfilm transistor may further be included for supporting any specificfunctions or properties of any thin film transistor.

In FIGS. 11 and 12, the switching thin film transistor ST and thedriving thin film transistor DT of the organic light emitting diodedisplay of the third application example are shown. The first and/or thesecond thin film transistors T1 and/or T2 explained from the first tothird embodiments of the present disclosure can be applied to this thinfilm transistor. For example, the second thin film transistor T2 havingthe oxide semiconductor material can be applied for the switching thinfilm transistor ST. The first thin film transistor T1 having thepolycrystalline semiconductor material may be applied for the drivingthin film transistor DT. Therefore, by including the first and thesecond thin film transistors T1 and T2 on one substrate, theitperformance and characteristics can compensate each other.

Fourth Application Example

For still another example, a driver element (or ‘driver IC’) may beformed in the non-display area of the same thin film transistorsubstrate for the flat panel display. Hereinafter, with reference toFIGS. 13 and 14, a thin film transistor substrate having the driver ICon the same substrate will be explained.

FIG. 13 is an enlarged plane view illustrating a structure of an organiclight emitting diode display according to a fourth application exampleof the present disclosure. FIG. 14 is a cross sectional viewillustrating a structure of the organic light emitting diode displayalong cutting line in FIG. 13, according to a fourth application exampleof the present disclosure. Here, because the explanation for the thinfilm transistor substrate having a driver therein is similar, a detailedexplanation about the thin film transistor substrate and the organiclight emitting diode will be omitted.

The plane structure of the organic light emitting diode displayaccording to the fourth application example will be explained in detailwith reference to FIG. 10. An organic light emitting diode displayaccording to the fourth application example comprises a substrate SUBincluding a display area AA for representing the video information and anon-display area NA having various elements for driving the elements inthe display area AA. In the display area AA, a plurality of pixel areasPA disposed in a matrix manner are defined. In FIG. 13, the pixel areaPA is illustrated as the dotted line.

For example, the pixel areas PA can be defined as an N (row)×M (column)matrix. However, the disposed pattern is not restricted this manner, buthas various types. Each of the pixel areas PA has the same size or adifferent size. With one unit pixel having three sub pixels includingred (R), green (G) and blue (B) sub pixels, the unit pixels areregularly disposed. Explaining a simple structure, the pixel area PA canbe defined by the crossing structure of a plurality of gate lines GLrunning in a horizontal direction and a plurality of data lines DLrunning in a vertical direction.

In the non-display area NA defined as the peripheral area surroundingthe pixel area PA, a data driving integrated circuit DIC for supplyingthe video data to the data line DL and a gate driving integrated circuitGIP for supplying the scan signal to the gate line GL are disposed. Forthat case of higher resolution display panel than VGA panel in whichmore data lines DL and more driving current lines VDD may be used, thedata driving integrated circuit DIC may be externally installed from thesubstrate SUB, and data contact pads may be disposed on the substrateSUB instead of the data driving integrated circuit DIC.

In order to simply show the structure of the display, the gate drivingintegrated circuit GIP is formed on one side portion of the substrateSUB directly. The ground line Vss for supplying the ground voltage maybe disposed at the outermost side of the substrate SUB. The ground lineVss is disposed so as to receive the ground voltage from an externaldevice located out of the substrate SUB, and to supply the groundvoltage to the data driving integrated circuit DIC and the gate drivingintegrated circuit GIP. For example, the ground line Vss may be linkedto the data driving integrated circuit DIC disposed at the upper side ofthe substrate SUB and to the gate driving integrated circuit GIPdisposed at the right side and/or left side of the substrate SUB so asto surround the substrate SUB.

At each pixel area PA, the main elements, such as an organic lightemitting diode and thin film transistors for driving the organic lightemitting diode, are disposed. The thin film transistor is disposed atthe thin film transistor area TA defined at one side of the pixel areaPA. The organic light emitting diode includes an anode electrode ANO, acathode electrode CAT and an organic light emission layer OL insertedbetween these two electrodes. The actual emission area is decided by thearea of the organic light emission layer OL overlapping the anodeelectrode ANO.

The anode electrode ANO has a shape as to occupy some area of the pixelarea PA and is connected to the thin film transistor formed in the thinfilm transistor area TA. The organic light emission layer OL isdeposited on the anode electrode ANO. The cathode electrode CAT isdeposited on the organic light emission layer OL to cover a wholesurface of the display area AA having the pixel areas PA.

The cathode electrode CAT may go over the gate driving integratedcircuit GIP and contact the ground line Vss disposed at the outer side.So, the ground voltage can be supplied to the cathode electrode CATthrough the ground line Vss. The cathode electrode CAT receives theground voltage and the anode electrode ANO receives the voltagecorresponding to the video data and then, by the voltage differencebetween the cathode electrode CAT and the anode electrode ANO, theorganic light emission layer OL radiates the light to represent thevideo information.

The cross-sectional structure of the organic light emitting diodedisplay according to the fourth application example will be explained indetail with reference to FIG. 14. On the substrate SUB, a non-displayarea NA and a display area AA are defined. The non-display area NAincludes an area where the gate driving integrated circuit GIP and theground line Vss are disposed. The display area AA includes an area wherea switching thin film transistor ST, a driving thin film transistor DTand an organic light emitting diode OLE are defined.

The gate driving integrated circuit GIP has thin film transistors thatare formed when the switching thin film transistor ST and the drivingthin film transistor DT are formed. The switching thin film transistorST in the pixel area PA has a gate electrode SG, a gate insulating layerGI, a channel layer SA, a source electrode SS and a drain electrode SD.In addition, the driving thin film transistor DT has a gate electrode DGconnected to the drain electrode SD of the switching thin filmtransistor ST, the gate insulating layer GI, a channel layer DA, asource electrode DS and a drain electrode DD.

On the thin film transistors ST and DT, a passivation layer PAS and aplanar layer PL are sequentially deposited. On the planar layer PL, ananode electrode ANO having an isolation shape within the pixel area PAis disposed. The anode electrode ANO connects to the drain electrode DDof the driving thin film transistor DT through the contact holepenetrating the passivation layer PAS and the planar layer PL.

On the substrate SUB having the anode electrode ANO, a bank BA isdeposited for defining the emission area. By patterning the bank BA, themost center portions of the anode electrode ANO are exposed. On theexposed anode electrode ANO, an organic light emission layer OL isdeposited. Depositing a transparent conductive material on the bank BAand the organic light emission layer OL, the cathode electrode CAT isstacked. The organic light emitting diode OLED including the anodeelectrode ANO, the organic light emission layer OL and the cathodeelectrode CAT is disposed.

In a case where the organic light emission layer OL generates the whitelight, color filters CF may be further included for representing fullcolor video information. In that case, the organic light emission layerOL may be deposited to cover the whole surface of the display area AA.

The cathode electrode CAT is expanded over the gate driving integratedcircuit GIP so that it may cover the display area AA and the non-displayarea NA and contact the ground line Vss disposed at the outercircumstance of the substrate SUB. As the result, the ground (or,reference) voltage can be supplied to the cathode electrode CAT via theground line Vss.

In addition, the ground line Vss may be formed at the same layer andmade of the same material with the gate electrodes SG and DG In thatcase, the cathode electrode CAT can be connected to the ground line Vssthrough the contact hole penetrating the passivation layer PAS and thegate insulating layer GI over the ground line Vss. Otherwise, the groundline Vss may be formed at the same layer and made of the same materialwith the source-drain electrodes SS-SD and DS-DD. In this case, thecathode electrode CAT can be connected to the ground line Vss throughthe contact hole penetrating the passivation layer PAS over the groundline Vss.

In FIGS. 13 and 14, the switching thin film transistor ST and thedriving thin film transistor DT of the organic light emitting diodedisplay of the fourth application example are shown. The first and/orthe second thin film transistors T1 and/or T2, explained in the first tothird embodiments of the present disclosure, can be applied to thesethin film transistors. For example, the second thin film transistor T2having the oxide semiconductor material can be applied for the switchingthin film transistor ST. The first thin film transistor T1 having thepolycrystalline semiconductor material may be applied for the drivingthin film transistor DT. Further, for the gate driver IC GIP, the firstthin film transistor T1 having the polycrystalline semiconductormaterial may be applied. For example, for the gate driver IC GIP, theC-MOS type thin film transistor may include P-MOS type and N-MOS typethin film transistors.

The thin film transistor substrate for flat panel display according tothe present disclosure comprises two different type thin filmtransistors on the same substrate so that the disadvantages of any onetype thin film transistor can be compensated by the other type thin filmtransistor. For example, with a thin film transistor having lowfrequency driving characteristics, the display can have a low powerconsumption property, and the display can be applied to portable and/orwearable appliances. Further, according to the method for manufacturingthe thin film transistor substrate, because the channel layer and thesource-drain electrodes of any one thin film transistor may formed atthe same time using a half-tone mask, the number of the mask processescan be reduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present inventionwithout departing from the spirit or scope of the invention. Thus, it isintended that the present invention cover the modifications andvariations of this invention provided they come within the scope of theappended claims and their equivalents.

What is claimed is:
 1. A method for manufacturing a thin film transistorsubstrate, comprising: forming a first semiconductor layer on asubstrate; depositing a gate insulating layer covering the firstsemiconductor layer; forming a first gate electrode and a second gateelectrode on the gate insulating layer; depositing an intermediateinsulating layer covering the first gate electrode and the second gateelectrode; depositing a second semiconductor material on theintermediate insulating layer; exposing a first portion and a secondportion of the first semiconductor layer by forming first and secondcontact holes through the second semiconductor material, theintermediate insulating layer. and the gate insulating layer; depositinga source-drain metal material on the second semiconductor material; andforming a first source electrode, a first drain electrode, a secondsource electrode, a second drain electrode and a second semiconductorlayer, by patterning the source-drain metal material and the secondsemiconductor material at the same time.
 2. The device according to theclaim 1, wherein the step for forming the first gate electrode and thesecond gate electrode includes: forming the first gate electrode on thegate insulating layer; depositing a lower intermediate insulating layeron the substrate having the first gate electrode; and forming the secondgate electrode on the lower intermediate insulating layer.